Lead, Semiconductor Manufacturing Engineer

Job Title: Lead, Semiconductor Manufacturing Engineer Job Code: 9653 Job Location: Palm Bay, FL Job Description: L3Harris Technologies is seeking a Semiconductor Manufacturing Engineer for the Microelectronics Operations Business Unit at our Palm Bay, FL location.
As a Semiconductor Manufacturing Engineer, you will directly interface with a multi-disciplinary team including Quality, Production, Material Management, other engineering disciplines focused on creating novel devices for our customers.
Responsibilities will include reviewing drawings, providing updates at status meetings, conducting change and manufacturing readiness review boards, trouble-shooting issues on the production floor with technical experts, and performing root cause/corrective actions for any issues that arise during builds.
Ideal candidates will be able to perform the following essential functions: Plan and support semiconductor fabrication efforts including capacity and throughput analyses, procurement support, work instructions generation, facilities/equipment planning, and resolution of manufacturing, quality, and reliability issues.
Plan and coordinate resources including manpower, equipment, and process resources in the day-to-day execution of the manufacturing tasks at the direction of Operations Management Support process, equipment, and manufacturing improvement initiatives that are technical and operational nature Design and develop manufacturing and engineering tools, strategies, and systems that support standardization of outputs, provide automated/assisted decisionmaking for floor personnel, and improve line efficiency while maintaining safety and quality standards Determine manufacturing costs, idnetify time standards for process steps and products, support improvement for reducing human error, and make recommendations for requirements on new or existing product lines Support the stand-up of a new Manufacturing Execution System (MES) Drive program schedules to meet critical deadlines on multiple parallel tasks Work effectively across organizational boundaries and clearly communicate project statuses and actions Create training material and perform on-the-job training for incoming new hires as the team grows Maintain a safe and organized work environment **This role may provide relocation assistance to the selected candidate(s) if minimum requirements are met.
** Qualifications: Bachelor’s Degree and minimum 9 years of prior relevant experience.
Graduate Degree and a minimum of 7 years of prior related experience.
In lieu of a degree, minimum of 13 years of prior related experience.
4+ years’ experience in semiconductor wafer manufacturing operations Ability to obtain a Top Secret Clearance Have an understanding of basic semiconductor processing with previous experience in one or more of the following areas: Advanced packaging processing (e.
g.
, wafer bonding, die bonding, C4, surface mount technology) Wafer-level processing (e.
g.
, lithography, wet etch, dry etch, PVD, PECVD, CMP, metrology) Preferred Additional Skills: Degree in Industrial Engineering, Mechanical Engineering, or Electrical Engineering Experience in implementing lean/six sigma techniques (FMEA, DFMA, DTC, DOE, and root cause/corrective action analysis) Exceptional organizational, verbal, and written communication skills Must have computer skills including MS Windows and office products (excel, PowerPoint, word, and project) Strong sense of responsibility, ownership, and follow-through Must be a team player, pro-active, and customer-oriented with a sense of urgency to accomplish a given task or goal Ability to lead teams, train, and mentor personnel Active Secret or Top Secret Clearance Experience working in classified government programs Previous experience working in a Class 100 cleanroom Knowledge of yield improvement and defect reduction Experience with DOEs, JMP, and statistical analysis Previous experience using commercial MES software Capable of managing multiple complex projects concurrently